Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9761770 | Optoelectronic semiconductor chip encapsulated with an ALD layer and corresponding method for production | Johann Eibl, Sebastian Taeger, Lutz Höppel, Karl Engl, Stefanie Rammelsberger +3 more | 2017-09-12 |