Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9583453 | Semiconductor packaging containing sintering die-attach material | Michael Matthews, Peter A Matturi, Eunsook Barber, Richard R. Weaver | 2017-02-28 |
| 9545017 | Structures for z-axis interconnection of multilayer electronic substrates | Christopher A. Hunrath, Khang Duy Tran, Kenneth C. Holcomb, G Delbert Friesen | 2017-01-10 |