Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806117 | Biased deep trench isolation | Gang Chen, Duli Mao, Dyson H. Tai, Yi Ma | 2017-10-31 |
| 9773829 | Through-semiconductor-via capping layer as etch stop layer | Gang Chen, Duli Mao, Dyson H. Tai | 2017-09-26 |
| 9691810 | Curved image sensor | Gang Chen, Duli Mao, Dyson H. Tai, Arvind Kumar, Hung-Chih Chang +1 more | 2017-06-27 |
| 9564470 | Hard mask as contact etch stop layer in image sensors | Gang Chen, Duli Mao, Dyson H. Tai | 2017-02-07 |
| 9565405 | Image sensor with enhanced quantum efficiency | Gang Chen, Dominic Massetti, Chih-Wei Hsiung, Arvind Kumar, Duli Mao +1 more | 2017-02-07 |