Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799617 | Methods for repackaging copper wire-bonded microelectronic die | Mitchell Curiel, Huan Gim Chan | 2017-10-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799617 | Methods for repackaging copper wire-bonded microelectronic die | Mitchell Curiel, Huan Gim Chan | 2017-10-24 |