Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9673081 | Isolated through silicon via and isolated deep silicon via having total or partial isolation | Hadi Jebory, David J. Howard, Marco Racanelli | 2017-06-06 |
| 9673191 | Efficient fabrication of BiCMOS devices | Todd Thibeault | 2017-06-06 |
| 9640528 | Low-cost complementary BiCMOS integration scheme | Todd Thibeault | 2017-05-02 |
| 9577035 | Isolated through silicon vias in RF technologies | Paul D. Hurwitz, Hadi Jebory | 2017-02-21 |