Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9761479 | Manufacturing method for semiconductor substrate | Ko IMAOKA, Motoki Kobayashi, Hidetsugu Uchida, Kuniaki Yagi, Takamitsu Kawahara +5 more | 2017-09-12 |
| 9751754 | Package formation method and MEMS package | Yuuichi KURASHIMA, Atsuhiko MAEDA | 2017-09-05 |
| 9580306 | Room temperature bonding apparatus and room temperature bonding method | Masato Kinouchi, Takayuki Goto, Takeshi Tsuno, Jun Utsumi, Kensuke Ide +3 more | 2017-02-28 |