FH

Fengze Hou

NC National Center For Advanced Packaging Co.: 1 patents #1 of 14Top 8%
Overall (2017): #425,265 of 506,227Top 85%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9653378 Heat dissipation solution for advanced chip packages Tingyu Lin 2017-05-16