Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748106 | Method for fabricating semiconductor package | Neng-Tai Shih | 2017-08-29 |
| 9576933 | Fan-out wafer level packaging and manufacturing method thereof | — | 2017-02-21 |
| 9543270 | Multi-device package and manufacturing method thereof | Shih-Fan Kuan | 2017-01-10 |