Issued Patents 2017
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831155 | Chip package having tilted through silicon via | — | 2017-11-28 |
| 9812414 | Chip package and a manufacturing method thereof | — | 2017-11-07 |
| 9799624 | Wire bonding method and wire bonding structure | — | 2017-10-24 |
| 9786593 | Semiconductor device and method for forming the same | — | 2017-10-10 |
| 9761535 | Interposer, semiconductor package with the same and method for preparing a semiconductor package with the same | — | 2017-09-12 |
| 9711442 | Semiconductor structure | — | 2017-07-18 |
| 9704818 | Semiconductor structure and manufacturing method thereof | — | 2017-07-11 |
| 9664852 | Optical waveguide having several dielectric layers and at least one metal cladding layer | — | 2017-05-30 |
| 9536785 | Method of manufacturing through silicon via stacked structure | — | 2017-01-03 |