GG

Guohua Gao

TC Tongfu Microelectronics Co.: 1 patents #2 of 8Top 25%
📍 Beijing, TX: #52 of 90 inventorsTop 60%
Overall (2017): #411,475 of 506,227Top 85%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9666550 Method and structure for wafer-level packaging — 2017-05-30