Issued Patents 2017
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9854677 | Module component | Hirofumi Shinagawa, Masaki KAWATA, Yuki Ito | 2017-12-26 |
| 9854663 | Radio frequency module | — | 2017-12-26 |
| 9848489 | Multilayer resin substrate, and method of manufacturing multilayer resin substrate | Hirofumi Shinagawa | 2017-12-19 |
| 9813595 | Camera module including multilayer base body, image sensor IC, lens unit, peripheral circuit components, and connector element and electronic device including same | Hirofumi Shinagawa, Jerry HSIEH, Satoshi Sasaki, Jun Sasaki, Nobuo IKEMOTO +1 more | 2017-11-07 |
| 9774070 | High-frequency signal line and manufacturing method thereof | Nobuo IKEMOTO, Yuki Wakabayashi | 2017-09-26 |
| 9743507 | Radio frequency module | — | 2017-08-22 |
| 9730322 | Production method of component-embedded substrate, and component-embedded substrate | Yuki Wakabayashi, Daisuke Tsuruga, Masaki KAWATA | 2017-08-08 |
| 9673502 | High-frequency signal transmission line and electronic device | Satoshi Sasaki, Nobuo IKEMOTO | 2017-06-06 |
| 9666925 | Transmission line, a transmission line apparatus, and an electronic device | Kuniaki YOSUI, Nobuo IKEMOTO, Zhujun Yang, Jun Sasaki, Fumie Matsuda +1 more | 2017-05-30 |
| 9629249 | Component-embedded substrate and communication module | Yuki Wakabayashi, Hirofumi Shinagawa | 2017-04-18 |
| 9565346 | Camera module | Nobuo IKEMOTO, Yuki Ito | 2017-02-07 |