Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711407 | Method of manufacturing a three dimensional integrated circuit by transfer of a mono-crystalline layer | Zvi Or-Bach, Brian Cronquist, Israel Beinglass, Deepak C. Sekar, Paul Lim | 2017-07-18 |