Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9833854 | Workpiece retainer, wire electric discharge machining device, thin-plate manufacturing method, and semiconductor-wafer manufacturing method | Takashi Yuzawa, Hidetaka Miyake, Atsushi Itokazu | 2017-12-05 |
| 9643270 | Wire discharge-machining apparatus with parallel cutting wires | Hidetaka Miyake | 2017-05-09 |
| 9550245 | Electric discharge machining apparatus, electric discharge machining method, and semiconductor substrate manufacturing method | Taichiro Tamida, Takashi Hashimoto, Akihiko Iwata | 2017-01-24 |