Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847298 | Three-dimensional integrated circuit laminate, and interlayer filler for three-dimensional integrated circuit laminate | Yasuhiro Kawase, Makoto Ikemoto | 2017-12-19 |
| 9822294 | Agglomerated boron nitride particles, composition containing said particles, and three-dimensional integrated circuit having layer comprising said composition | Masanori Yamazaki, Mari Abe, Tomohide Murase, Yasuhiro Kawase, Makoto Ikemoto +1 more | 2017-11-21 |