Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9679834 | Semiconductor dies with recesses, associated leadframes, and associated systems and methods | Chua Swee Kwang | 2017-06-13 |
| 9653444 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Meow Koon Eng, Suan Jeung Boon | 2017-05-16 |