Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9653381 | Semiconductor structures and die assemblies including conductive vias and thermally conductive elements and methods of forming such structures | — | 2017-05-16 | $14,903,000 |