Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748136 | Method for forming an electrically conductive via in a substrate | Ronny VAN 'T OEVER, Marko Theodoor Blom, Johannes Oonk, Peter Tijssen | 2017-08-29 |
| 9573804 | Method of bonding two substrates and device manufactured thereby | Ronny VAN 'T OEVER, Marko Theodoor Blom, Johannes Oonk, Marinus Bernardus Olde Riekerink, Peter Tijssen +4 more | 2017-02-21 |