Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704785 | Semiconductor package with die paddle | Yi-Hui Lee | 2017-07-11 |
| 9704792 | Semiconductor package assembly | Che-Ya Chou | 2017-07-11 |
| 9704808 | Semiconductor device and wafer level package including such semiconductor device | Shih-Yi Syu, Che-Ya Chou | 2017-07-11 |