Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711424 | Low thermal stress package for large area semiconductor dies | Richard J. Bono | 2017-07-18 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711424 | Low thermal stress package for large area semiconductor dies | Richard J. Bono | 2017-07-18 |