Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9603254 | Apparatus for filling a wafer via with solder | Sehoon Yoo, Chang Woo Lee, Jeong Han Kim, Young Ki Ko | 2017-03-21 |
| 9539970 | Airbag sensor module and car body integrated with airbag sensor module | Chang Woo Lee, Se Hoon Yoo, Jung Hwan Bang, Yong Ho Ko, Jeong Han Kim +3 more | 2017-01-10 |