Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748192 | Printed circuit board having a post bump | Ji Haeng Lee, Dong Sun Kim | 2017-08-29 |
| 9706652 | Printed circuit board and method for manufacturing same | Seong Bo Shim, Seung Yul Shin | 2017-07-11 |
| 9589878 | Semiconductor package | Dong Sun Kim, Hyun Seok Seo, Ji Haeng Lee | 2017-03-07 |