Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9623635 | Chip through flooring material using PLA resin | Cheng Zhe Huang, Ji-Young Kim, Ki Bong Park, Jun-Hyuk Kwon, Hyun-Jong Kwon +3 more | 2017-04-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9623635 | Chip through flooring material using PLA resin | Cheng Zhe Huang, Ji-Young Kim, Ki Bong Park, Jun-Hyuk Kwon, Hyun-Jong Kwon +3 more | 2017-04-18 |