Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9570429 | Methods of fabrication and testing of three-dimensional stacked integrated circuit system-in-package | Jianhong Mao, Zhiwei Wang, Wenfen Chang | 2017-02-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9570429 | Methods of fabrication and testing of three-dimensional stacked integrated circuit system-in-package | Jianhong Mao, Zhiwei Wang, Wenfen Chang | 2017-02-14 |