Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711438 | Semiconductor device and method of forming a dual UBM structure for lead free bump connections | Stephen A. Murphy, Wei-Chung Sun | 2017-07-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711438 | Semiconductor device and method of forming a dual UBM structure for lead free bump connections | Stephen A. Murphy, Wei-Chung Sun | 2017-07-18 |