Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9570415 | Chip packaging method and chip package using hydrophobic surface | Hyo-Hoon Park, Jong-Hun Kim, Sun Kyu Han | 2017-02-14 |
SS
Suk Min Seo
Overall (2017): #229,086 of 506,227Top 50%
1
Patents 2017