Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9853010 | Method of fabricating a semiconductor package | Hyun Cheol Bae, Yong Sung EOM, Jin Ho Lee, Haksun LEE | 2017-12-26 |
| 9538666 | Bonding structure of electronic equipment | Hyun Cheol Bae, Haksun LEE, Yong Sung EOM | 2017-01-03 |