Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831167 | Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof | Ting-Hao Lin, Yi-Fan Kao, Yu-Te Lu, Kuo-Chun Huang | 2017-11-28 |
| 9754870 | Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof | Ting-Hao Lin, Yi-Fan Kao, Yu-Te Lu, Kuo-Chun Huang | 2017-09-05 |