Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721824 | Wafer bonding method and device with reduced thermal expansion | Kuan-Wei Chen, Pei-Jer Tzeng, Chien-Chou Chen | 2017-08-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721824 | Wafer bonding method and device with reduced thermal expansion | Kuan-Wei Chen, Pei-Jer Tzeng, Chien-Chou Chen | 2017-08-01 |