John E. McConnell — 4 Patents at Kemet Electronics

Issued Patents 2017

Showing 1–4 of 4 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9805872	Multiple MLCC modules	Galen W. Miller, John Bultitude, Garry L. Renner	2017-10-31	$10,722,000
9793057	Electronic component termination and assembly by means of transient liquid phase sintering metallurgical bond	Garry L. Renner, John Bultitude	2017-10-17	$7,978,000
9779874	Sintering of high temperature conductive and resistive pastes onto temperature sensitive and atmospheric sensitive materials	John Bultitude, Abhijit Gurav	2017-10-03	$14,369,000
9748043	Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitors	Antony P. Chacko, Robert Ramsbottom, Philip M. Lessner, Randolph S. Hahn, John Bultitude	2017-08-29	$13,757,000