Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9809735 | Highly-thermally-conductive resin composition, and resin material for heat dissipation/heat transfer and thermally conductive film comprising same | Syoji Ubukata, Kazuaki Matsumoto | 2017-11-07 |