Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9627303 | Etching-before-packaging three-dimensional system-level metal circuit board structure inversely provided with chip, and technological method | Youhai Zhang, Kai Zhang, Xiaojing Liao, Yaqin Wang | 2017-04-18 |