Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741680 | Wire bond through-via structure and method | Randy Bindrup, John Leon, James Yamaguchi, Angel Pepe | 2017-08-22 |
| 9728507 | Cap chip and reroute layer for stacked microelectronic module | Sambo He | 2017-08-08 |