Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9607938 | Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof | Minkyung Kang, YoungDal Roh, Dong Ju Jeon | 2017-03-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9607938 | Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof | Minkyung Kang, YoungDal Roh, Dong Ju Jeon | 2017-03-28 |