Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9633970 | IGBT device and method for packaging whole-wafer IGBT chip | Yudong Wu, Yongdian Peng | 2017-04-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9633970 | IGBT device and method for packaging whole-wafer IGBT chip | Yudong Wu, Yongdian Peng | 2017-04-25 |