Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9793199 | Circuit board with via trace connection and method of making the same | Andrew KW Leung, Neil McLellan | 2017-10-17 |
| 9576923 | Semiconductor chip with patterned underbump metallization and polymer film | Roden R. Topacio, Suming Hu | 2017-02-21 |