Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806063 | Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliability | Chin-Kwan Kim, Rajneesh Kumar, Jie Fu, Ahmer Syed, Milind Shah +1 more | 2017-10-31 |