Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773685 | Solder joint flip chip interconnection having relief structure | Rajendra D. Pendse, KyungOe Kim | 2017-09-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773685 | Solder joint flip chip interconnection having relief structure | Rajendra D. Pendse, KyungOe Kim | 2017-09-26 |