Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847244 | Semiconductor device and method | — | 2017-12-19 |
| 9812386 | Encapsulated semiconductor package | Ronald Patrick Huemoeller, David Jon Hiner | 2017-11-07 |
| 9691635 | Buildup dielectric layer having metallization pattern semiconductor package fabrication method | Ronald Patrick Huemoeller, David Jon Hiner | 2017-06-27 |