Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818839 | Method of forming metal contacts in the barrier layer of a group III-N HEMT | Yoshikazu Kondo, Hiroshi Yamasaki, Masahiro Iwamoto | 2017-11-14 |
| 9679866 | Bonding stage and method of manufacturing the same | — | 2017-06-13 |
| 9640462 | Semiconductor device having wiring pad and wiring formed on the same wiring layer | — | 2017-05-02 |