Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9627228 | Method for manufacturing a chip package having a coating layer | Sheng-I Huang, Ying Chen, Ta-Hao Chang, I-Fong Antonio Wu, Chi-Chung Yu | 2017-04-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9627228 | Method for manufacturing a chip package having a coating layer | Sheng-I Huang, Ying Chen, Ta-Hao Chang, I-Fong Antonio Wu, Chi-Chung Yu | 2017-04-18 |