Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728518 | Interconnect etch with polymer layer edge protection | — | 2017-08-08 |
| 9576923 | Semiconductor chip with patterned underbump metallization and polymer film | Suming Hu, Yip Seng Low | 2017-02-21 |