RS

Roger D. St.Amand

AT Amkor Technology: 1 patents #48 of 116Top 45%
Overall (2017): #260,407 of 506,227Top 55%
1
Patents 2017

Issued Patents 2017

Patent #TitleCo-InventorsDate
9711485 Thin bonded interposer package Christopher J. Berry, Jin Seong Kim 2017-07-18