PW

Peng Wang

QU Qualcomm: 1 patents #1,395 of 3,039Top 50%
Overall (2017): #280,393 of 506,227Top 60%
1
Patents 2017

Issued Patents 2017

Patent #TitleCo-InventorsDate
9746889 Package-on-package (PoP) device comprising bi-directional thermal electric cooler Rajat Mittal, Hee Jun Park, Mehdi Saeidi, Arpit Mittal 2017-08-29