Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9809903 | Methods for top-down fabrication of wafer scale TMDC monolayers | Saptarshi Das, Mrinal K. Bera, Andreas Roelofs | 2017-11-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9809903 | Methods for top-down fabrication of wafer scale TMDC monolayers | Saptarshi Das, Mrinal K. Bera, Andreas Roelofs | 2017-11-07 |