Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9655236 | Method to make a multilayer circuit board with intermetallic compound and related circuit boards | Michael Raymond Weatherspoon, Louis Joseph Rendek, Jr., Casey Philip Rodriguez | 2017-05-16 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9655236 | Method to make a multilayer circuit board with intermetallic compound and related circuit boards | Michael Raymond Weatherspoon, Louis Joseph Rendek, Jr., Casey Philip Rodriguez | 2017-05-16 |