| 9831220 |
Light emitting diode (LED) arrays including direct die attach and related assemblies |
Matthew Donofrio, Christopher P. Hussell |
2017-11-28 |
| 9810379 |
LED lamp |
Christopher P. Hussell, Gerald H. Negley, Curt Progl, Mark Edmond, Praneet Athalye +6 more |
2017-11-07 |
| RE46588 |
Group III nitride LED with undoped cladding layer |
Kathleen Marie Doverspike, Hua-Shuang Kong, Michael John Bergmann |
2017-10-24 |
| RE46589 |
Group III nitride LED with undoped cladding layer and multiple quantum well |
Kathleen Marie Doverspike, Hua-Shuang Kong, Michael John Bergmann, David T. Emerson |
2017-10-24 |
| 9754926 |
Light emitting diode (LED) arrays including direct die attach and related assemblies |
Matthew Donofrio, Hua-Shuang Kong, Peter Scott Andrews, David T. Emerson |
2017-09-05 |
| 9673363 |
Reflective mounting substrates for flip-chip mounted horizontal LEDs |
Matthew Donofrio, Peter Scott Andrews, David Chang |
2017-06-06 |
| 9660153 |
Gap engineering for flip-chip mounted horizontal LEDs |
David T. Emerson, Raymond Rosado, Matthew Donofrio |
2017-05-23 |
| 9640737 |
Horizontal light emitting diodes including phosphor particles |
Matthew Donofrio, James Ibbetson, David T. Emerson, Michael John Bergmann, Kevin Haberern +2 more |
2017-05-02 |
| 9608166 |
Localized annealing of metal-silicon carbide ohmic contacts and devices so formed |
David B. Slater, Jr., Matthew Donofrio |
2017-03-28 |
| 9559252 |
Substrate removal process for high light extraction LEDs |
— |
2017-01-31 |