Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9825005 | Semiconductor package with Pillar-Top-Interconnection (PTI) configuration and its MIS fabricating method | Yun-Hsin Yeh | 2017-11-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9825005 | Semiconductor package with Pillar-Top-Interconnection (PTI) configuration and its MIS fabricating method | Yun-Hsin Yeh | 2017-11-21 |