Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9848518 | Integrated power module packaging structure | Te-Wei Yuan, Yi-Kai Chou, Ming-Yuan Tsai, Wei-Hao CHI | 2017-12-19 |
| 9698507 | Package structure of power module | Kai-Ti Chang, Ching-Chi Yang, Chuna-Jia Cheng | 2017-07-04 |