Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847291 | Circuits incorporating integrated passive devices having inductances in 3D configurations and stacked with corresponding dies | Poh Boon Leong, Sehat Sutardja, Wei Ding, Huy Thong Nguyen | 2017-12-19 |