EY

Edward J. Yarmchuk

IBM: 2 patents #3,254 of 10,852Top 30%
📍 Armonk, NY: #7 of 25 inventorsTop 30%
🗺 New York: #2,508 of 12,278 inventorsTop 25%
Overall (2017): #156,053 of 506,227Top 35%
2
Patents 2017

Issued Patents 2017

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9786572 Flip chip ball grid array with low impedance and grounded lid Martin Beaumier, Yves Dallaire, Melania C. Doll, Michael Michael Gaynes 2017-10-10
9714911 Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures Timothy J. Chainer, Michael A. Gaynes 2017-07-25